The eBeam Initiative provides a forum for educational and promotional activities regarding a new design-to-manufacturing approach, known as Design for e-beam (DFEB), that reduces mask costs for semiconductor devices.

Where Electronics Begins™ best describes the Electronic Design Automation (EDA) industry. The EDA Consortium represents this vital industry on a worldwide scale. It is the international association of companies developing design tools and services that enable engineers to create the world's electronic products. The EDA Industry provides the critical technology to design electronics that enable the Information Age, including: communications, computers, space technology, medical and industrial equipment and consumer electronics.

GSA is the voice of the global fabless business model. Industry leaders incorporated GSA in 1994 on the premise that the fabless business model would be a viable, long-term business model. Today, the viability of outsourcing as a sustainable business model for the industry has been proven, and GSA is focused on the perpetuation of this business model throughout the worldwide semiconductor industry.

JEDEC is the leading developer of standards for the solid-state industry. Almost 3300 participants, appointed by some 300 companies work together in 50 JEDEC committees to meet the needs of every segment of the industry, manufacturers and consumers alike. The publications and standards that they generate are accepted throughout the world. All JEDEC standards are available online, at no charge.

The MIPI Alliance is a non-profit corporation that operates as an open membership organization. All companies in the mobile industry are encouraged to join, including handset manufacturers, semiconductor companies, hardware peripheral manufacturers, and operating system vendors. Today nearly 165 member companies actively participate in the Alliance. The common objective of MIPI members is to simplify the design and implementation of hardware and software by driving consistency in processor and peripheral interfaces, promoting reuse and compatibility in mobile devices. Ultimately, the MIPI Alliance will help enable the mobile industry to introduce more sophisticated devices at an accelerated rate.

The Peripheral Component Interconnect Special Interest Group (PCI-SIG) is committed to the development and enhancement of the PCI standard. Crediting its success to the commitment of more than 900 members, the PCI-SIG strives to provide these members with the resources they need to remain competitive.

As the industry pushes toward smaller process geometries, the existing design infrastructure must be upgraded holistically to automate power-lowering design techniques. Most power-control methods in use today are manual and implemented ad hoc, leading to increased risk and cost. Across the design and manufacturing chain, an urgent need has emerged for an automated, power-aware design infrastructure. To facilitate and support a new era of low-power design innovation, Cadence has formed the Power Forward Initiative.

The Semiconductor Industry Association (SIA) is the premier trade association representing the U.S. semiconductor industry. Founded in 1977 by five microelectronics innovators, SIA unites 95 companies responsible for more than 85 percent of semiconductor production in this country.

Our coalition provides domestic semiconductor companies a forum to advance the global competitiveness of the $80 billion U.S. chip industry. Through a network of corporate CEOs and working committees, SIA shapes public policy on issues critical to the industry and provides a spectrum of services to aid members in growing their own businesses.

Silicon Integration Initiative (Si2) is an organization of industry-leading companies in the semiconductor, electronic systems  and EDA tool industries. We are focused on improving productivity and reducing cost in creating and producing integrated silicon systems. We believe that through collaborative efforts, the industry can achieve higher levels of systems-on-silicon integration while reducing the cost and complexity of integrating future design systems.